| Commercially Pure Molybdenum | Usually ≥99.95% Mo; oxygen and impurity limits depend on the material specification. | Approximately 10.2–10.3 g/cm³ | Melting point about 2,623°C; low thermal expansion of approximately 4.8 × 10−6/K near room temperature; good thermal conductivity, typically around 130–140 W/m·K at room temperature. | Approximately 0.05–6 mm, subject to rolling condition and order quantity. | High-temperature furnace parts, heat shields, sputtering targets, electrical contacts, laboratory components and structural parts used in vacuum or protective atmospheres. | General-purposeCost-sensitiveHigh-purity work | Confirm purity, oxygen content, grain direction, surface finish, flatness, edge condition and whether the application is vacuum, inert gas or hydrogen protected. |
| TZM Molybdenum Alloy Sheet | Commonly about 0.08–0.12% Ti, 0.04–0.08% Zr and 0.01–0.04% C, with the balance Mo; exact limits vary by specification. | Approximately 10.0–10.2 g/cm³ | Higher elevated-temperature strength and creep resistance than commercially pure Mo; improved resistance to deformation in demanding furnace and tooling environments. | Approximately 0.1–6 mm for rolled sheet, depending on supply capability and condition. | Hot-zone supports, high-temperature tooling, die inserts, furnace components, aerospace thermal hardware and parts exposed to mechanical load at elevated temperature. | High-temperature strengthLoad-bearing | Specify alloy chemistry, tensile or yield requirements at the intended temperature, recrystallization condition, rolling direction, grain size and forming limitations. |
| Molybdenum–Lanthanum Oxide Sheet | Typically Mo containing approximately 0.3–1.0 wt% La2O3; the exact oxide content is product-specific. | Approximately 10.0–10.2 g/cm³ | Dispersion-strengthened structure can improve high-temperature strength, sag resistance and resistance to recrystallization compared with pure Mo. | Approximately 0.1–3 mm, depending on the production route and required surface quality. | Furnace heating elements, high-temperature shields, lamp and cathode components, glass-processing fixtures and thin sheet parts requiring dimensional stability. | Sag resistanceThin sections | Verify La2O3 content, dispersion uniformity, bend radius, surface defects, recrystallization behavior and compatibility with the process atmosphere. |
| Molybdenum–Rhenium Sheet | Common commercial grades often contain approximately 41–50 wt% Re, with the balance Mo. | Approximately 12.5–13.7 g/cm³, depending on rhenium content | Improved room-temperature ductility and formability compared with unalloyed Mo; useful where thermal cycling, bending or complex forming is required. | Approximately 0.05–2 mm for precision sheet, depending on alloy grade and order requirements. | Thermocouple components, high-temperature sensors, aerospace parts, electrical contacts and formed components exposed to thermal cycling. | FormabilityThermal cyclingPrecision parts | Check rhenium percentage, ductility, bend performance, grain structure, weldability, radiological or analytical handling requirements and the substantial raw-material cost impact. |
| Molybdenum–Tungsten Alloy Sheet | Commonly selected with approximately 10–30 wt% W, with the balance Mo; higher tungsten contents are also possible. | Approximately 10.4–11.2 g/cm³ for common compositions | Combines the high-temperature capability of Mo with increased tungsten content; properties vary significantly with composition, processing and heat treatment. | Approximately 0.1–4 mm, depending on composition and rolling condition. | High-temperature furnace hardware, radiation shielding, specialized electrodes and components requiring tailored thermal and mechanical performance. | Property customizationExtreme-temperature use | Define tungsten content, density target, thermal expansion, thermal conductivity, hardness, machinability and the required dimensional tolerances before quoting. |
| Molybdenum–Copper Composite Sheet | Typically a bonded or infiltrated Mo–Cu composite; copper content is often selected within approximately 10–50 vol% according to thermal requirements. | Approximately 9.5–11.5 g/cm³, depending on Mo/Cu ratio and structure | Higher thermal and electrical conductivity than pure Mo, with a coefficient of thermal expansion that can be tailored by changing the Mo/Cu ratio; not a conventional single-phase Mo alloy. | Approximately 0.2–5 mm for laminated or composite sheet forms. | Heat spreaders, power-electronics substrates, thermal-management plates, RF components and vacuum-compatible heat-transfer parts. | Thermal managementCTE matchingElectrical conductivity | Specify construction type, copper volume fraction, thermal conductivity, coefficient of thermal expansion, bond integrity, warpage, plating compatibility and operating atmosphere. |
